In bridging research out of academia and into manufacturing, there exists an unmet need for CNTs that meet the stringent requirements of the nanoelectronics industry. Specifically, the CNTs should be 1) aligned, 2) high semiconducting purity, and 3) entirely CMOS fabrication compatible.
We utilize our established wafer scale chemical vapor deposition (CVD) growth technique for aligned CNTs. Through regular interaction with our customers, including a major integrated circuit foundry, we will ensure that our technology development roadmap is tightly aligned to industrial specifications and timelines.
Our innovation lies in a purification scheme that maintains CNT alignment. This purification process utilizes the differing absorption of electromagnetic radiation for metallic and semiconducting CNTs. A protective polymer layer is spun over the entire CNT population. When irradiated at proper power and wavelength, the metallic CNTs will heat significantly more than semiconducting CNTs. Finally, the polymer layer is removed selectively leaving the purified semiconducting CNTs behind.
All steps of our aligned growth and purification processes are CMOS-foundry compatible. Our team has verified selective CNT removal process through fabrication of suites of CNTFET.
Carbon nanotube (CNT) transistors have the potential to revolutionize the electronics industry. With their high electron mobility and excellent thermal conductivity, CNTs are well-suited for use in next-generation computer processors, high-speed communication devices, and other advanced electronics. In this post, we’ll take a closer look at CNT transistors and their potential to transform the electronics landscape.
CNTs possess high thermal conductivity and electrical conductivity. They can efficiently conduct and dissipate heat. Their excellent electrical conductivity enables efficient charge transport, low resistance, and high-speed electronic devices.
CNTs have a nanoscale diameter, allowing for miniaturization of devices. Their small size enables the fabrication of ultra-compact and high-density integrated circuits, leading to advancements in areas such as nanoelectronics, wearable devices, and Internet of Things (IoT) applications.
CNTs can be integrated into existing semiconductor manufacturing processes, allowing for potential compatibility and scalability. This compatibility facilitates the incorporation of CNTs into established semiconductor technologies without requiring significant changes to fabrication techniques.